Semiconductor workpiece proximity plating apparatus

ABSTRACT

The present invention relates to methods and apparatus for plating a conductive material on a semiconductor substrate by rotating pad or blade type objects in close proximity to the substrate, thereby eliminating/reducing dishing and voids. This is achieved by providing pad or blade type objects mounted on cylindrical anodes or rollers and applying the conductive material to the substrate using the electrolyte solution disposed on or through the pads, or on the blades. In one embodiment of the invention, the pad or blade type objects are mounted on the cylindrical anodes and rotated about a first axis while the workpiece may be stationary or rotate about a second axis, and metal from the electrolyte solution is deposited on the workpiece when a potential difference is applied between the workpiece and the anode. In another embodiment of the present invention, the plating apparatus includes an anode plate spaced apart from the cathode workpiece. Upon application of power to the anode plate and the cathode workpiece, the electrolyte solution disposed in the plating apparatus is used to deposit the conductive material on the workpiece surface using cylindrical rollers having the pad or blade type objects.

FIELD OF THE INVENTION

[0001] The present invention relates to methods and apparatus forplating a conductive material on a semiconductor substrate. Moreparticularly, the present invention is directed to “proximity plating”methods and apparatus for plating the conductive material on thesemiconductor substrate. The substrate is plated with the conductivematerial as the pad and/or blade type objects are rotated in closeproximity to the substrate.

BACKGROUND OF THE INVENTION

[0002] A conventional process step in the manufacturing of integratedcircuits and devices involves plating a conductive layer on asemiconductor substrate. Plating the substrate with the conductivematerial over a seed layer has important and broad application in thesemiconductor industry. Traditionally, aluminum and other metals aredeposited as one of many conductive layers that make up a semiconductorchip. However, in recent times, there is great interest in copperdeposition for interconnects on semiconductor chips, because, comparedto aluminum, copper reduces electrical resistance and allowssemiconductor chips to run faster with less heat generation, resultingin a significant gain in chip capacity and efficiency.

[0003] Typically, the semiconductor substrate has been previously etchedand contains many holes and/or trenches on its surface. One goal ofplating is to uniformly fill the holes and trenches with the conductivematerial.

[0004] However, as known in the art, conventional plating methods resultin “dishing” or non-planar deposition during the plating process. InFIG. 1A, a barrier layer 4 and a seed layer 6 is disposed upon asubstrate 2, where a section of the substrate 2 includes a trench 12.After forming the barrier layer 4 and the seed layer 6, a conductivelayer 8 is plated on top of the seed layer 6. Because the trench 12 maybe relatively large, a recess 10 is formed thereon and dishing results.

[0005] For small features with sub-micron size dimensions, existence ofvoids in the deposited conductive layer is a common problem. In FIG. 1B,such a void 14 is formed near the bottom of a narrow hole 16. It is wellknown that the existence of such voids in the deposited conductive layerresults in defective devices with poor performance. Accordingly, thepresent invention provides a more accurate, fast, cost effective, andreliable manner of applying the conductive material to the semiconductorsubstrate.

SUMMARY OF THE INVENTION

[0006] It is an object of the present invention to provide methods andapparatus that deposit a conductive material on a substrate with the pador blade type objects rotating in a circular manner.

[0007] It is another object of the present invention to provide methodsand apparatus that deposit a conductive material on a substrate whileeliminating/reducing dishing and voids.

[0008] It is yet another object of the present invention to providemethods and apparatus that deposit a conductive material on a substrateusing novel pad-anode or blade-anode assemblies.

[0009] These and other objects of the present invention are obtained byproviding methods and apparatus for depositing a conductive materialfrom an electrolyte solution to the substrate. This is achieved byproviding pad or blade type objects mounted on cylindrical anodes orrollers and applying the conductive material to the substrate using theelectrolyte solution disposed on or through the pads or on the blades.

[0010] An apparatus that performs such plating includes anodes and acathode workpiece that are in close proximity of each other. The pad orblade type objects mounted on the cylindrical anodes or rollers rotateabout a first axis and the workpiece may be stationary or rotate about asecond axis, and metal from the electrolyte solution is deposited on theworkpiece when a potential difference is applied between the workpieceand the anode.

[0011] Alternatively, the plating apparatus may include an anode platespaced apart from the cathode workpiece. Upon application of power tothe anode plate and the cathode workpiece, the electrolyte solutiondisposed in the plating apparatus is used to deposit the conductivematerial on the workpiece surface using cylindrical rollers having thepad or blade type objects.

[0012] Further, in another embodiment, the plating apparatus may includean anode plate spaced apart from cylindrical cathodes having conductivepads or blades. Upon application of power to the anode plate and thecathodes and upon rotating the cathodes in a circular direction, theconductive pads or blades make electric contact to the workpiece surfacerendering it cathodic with respect to the anode plate, and metal from anelectrolyte solution is deposited on the same surface.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013] These and other objects and advantages of the present inventionwill become apparent and more readily appreciated from the followingdetailed description of the presently preferred exemplary embodiments ofthe invention taken in conjunction with the accompanying drawings, ofwhich:

[0014]FIG. 1A illustrates a cross sectional view of a conductive layerdisposed on a substrate with “dishing” characteristics;

[0015]FIG. 1B illustrates a cross sectional view of a substrate having ahole containing a void therein;

[0016]FIG. 2 illustrates a cross sectional view of a substrate having aconductive layer where dishing is eliminated/reduced;

[0017]FIG. 3 illustrates a cross sectional view of a “proximity plating”apparatus in accordance with the first preferred embodiment of thepresent invention;

[0018] FIGS. 4A-4B illustrate perspective views of pad-anode assembliesin accordance with the preferred embodiment of the present invention;

[0019] FIGS. 5-6 illustrate cross sectional views of embodiments usinganode rods in accordance with the preferred embodiment of the presentinvention;

[0020]FIG. 7 illustrates a cross sectional view of a “proximity plating”apparatus in accordance with the second preferred embodiment of thepresent invention; and

[0021]FIG. 8 illustrates a cross sectional view of a “proximity plating”apparatus in accordance with the third preferred embodiment of thepresent invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] The preferred embodiments of the present invention will now bedescribed with reference to FIGS. 2-8. The inventors of the presentinvention herein disclose methods and apparatus for “proximity plating”a conductive material on a semiconductor substrate. The presentinvention contemplates different embodiments to be used to plate/deposita conductive material onto the substrate and into the contacts, vias,holes, trenches, and the like. While the present invention can be usedwith any conductive material, it is especially suited for use withcopper as the conductor and for use in the fabrication of VLSI and ULSIintegrated circuits having submicron size features. Furthermore,semiconductor workpieces such as a wafer, a flat panel, magnetic filmhead, or the like may be used in accordance with the present invention.

[0023] An example of a proximity plating method and apparatus isdisclosed in a co-pending U.S. application Ser. No. 09/285,621, entitled“Method and Apparatus For Plating and Polishing a SemiconductorSubstrate”, commonly owned by the assignee of the present invention, thecontents of which are expressly incorporated herein by reference. Thepresent invention discloses alternative embodiments.

[0024] One object of the present invention is to eliminate dishing. FIG.2 illustrates a cross sectional view of a substrate where dishing iseliminated/reduced as the conductive layer 8 is deposited onto thesubstrate 2. A relatively uniform flat conductive layer 8 can beobtained by plating the conductive material at a high mass transferrate, as described in more detail in the present invention. Anotherobject of the present invention is to eliminate voids in the platedmaterial. Eliminating/reducing dishing and eliminating voids are highlydesirable in order to manufacture a high quality integratedcircuit/device.

[0025]FIG. 3 illustrates a cross sectional view of a “proximity plating”apparatus in accordance with the first preferred embodiment of thepresent invention. FIG. 3 illustrates a nonconductive chamber 100 havingan electrolyte solution 110 disposed therein. The chamber 100 includesanode assemblies 120 a, 120 b, etc., having multiple strips of pads 130a, 130 b, etc., mounted, or machined onto the cylindrical anodes 140 a,140 b, etc. The cylindrical anodes 140 a, 140 b, etc., may be hollowcylinders formed from conductors such as carbon and titanium having adiameter between 10 to 30 mm.

[0026] As shown, the cylindrical anodes 140 a, 140 b, etc., are inpartial contact with the electrolyte solution 110. In other words, thetop level of the electrolyte solution 110 is below the surface of aworkpiece 160 (i.e., the top level of the electrolyte solution 110 doesnot make direct contact with the workpiece surface when the cylindricalanodes 140 a, 140 b, etc., are stationary). Alternatively, theelectrolyte solution 110 may be making contact with the workpiece 160surface.

[0027] During operation, a voltage is applied between the cylindricalanodes 140 a, 140 b, etc., and a cathode workpiece 160. Electricalcontact to the cathode workpiece 160 is made via cathode contacts 184.When the anodes 140 a, 140 b, etc., and the pad strips (or pads) 130 a,130 b, etc., are rotating about axis 150 in either a clockwise orcounterclockwise direction, and are spaced apart from the cathodeworkpiece 160 (the pad strips 130 a, 130 b, etc. do not make directcontact with the workpiece 160, or alternatively, make only slightcontact), the workpiece 160 is plated using the electrolyte solution110.

[0028] The anodes 140 a, 140 b, etc. and the pad strips 130 a, 130 b,etc. should preferably rotate at a rate such that the electrolytesolution 110 is continuously “picked” by the anodes 140 a, 140 b, etc.,and applied/splashed onto the workpiece 160. They may all rotate in thesame clockwise or counterclockwise direction or alternatively, some mayrotate in one direction (i.e., clockwise) while others may rotate in theopposite direction (i.e., counterclockwise). Further, during operation,one, two, three, . . . , or all anodes 140 a, 140 b, etc., may beactivated concurrently and voltages may be applied to all or only aselected number of them. Anode current densities for different anodes140 a, 140 b, etc., may vary, and this can be used to control theuniformity of the deposited material across the workpiece 160. Inaddition, the length of the anodes 140 a, 140 b, etc., may all be thesame or they may be different.

[0029] When the gaps between the pads 130 a, 130 b, etc., and theworkpiece 160 are about 0-5 mm and contains a meniscus of electrolytesolution 110, a very high mass transport results, thereby depositinghigh quality metal films onto the workpiece 160. Moreover, when electricpower is applied to the cylindrical anodes 140 a, 140 b, etc., and thecathode workpiece 160, a closed electrical circuit is formed through theanode assemblies 120 a, 120 b, etc., the applied/splashed electrolytesolution 110 in the gaps, and the workpiece 160. This is described inmore detail below. Moreover, depending on the type, shape, and structureof the pads 130 a, 130 b, etc., the gaps may be greater than 5 mm.

[0030] The workpiece head assembly 180 may include a nonconductive,preferably circular chuck 182 with a cavity that is preferably a fewmillimeters deep at its center and which cavity may contain a restingpad (not shown). The workpiece 160 is loaded into the cavity, backsidefirst, against the resting pad using a conventional type of transport orvacuum mechanism to ensure that the workpiece 160 is stationary withrespect to the workpiece head assembly 180 while in use. A nonconductiveretaining ring (not shown) such as an O-ring or other rubber type ofseal at the periphery of the workpiece head assembly 180 and the cathodecontacts 184 each push against the edge of the workpiece 160 and hold itin place. The entire back side of the workpiece 160 which pushes againstthe chuck 182 that is under the retaining ring is thus protected fromany and all solutions, including electrolyte. Other conventionalworkpiece head assemblies can be used in accordance with the presentinvention.

[0031] As shown, the workpiece head assembly 180 faces toward the anodeassemblies 120 a, 120 b, etc. The head assembly 180 may be stationary orrotate around axis 190 using a conventional motorized spindle (notshown). The head assembly 180 may also be adapted to move up and downand/or side to side in the direction of arrow 192 so that the workpiece160 may be plated more effectively.

[0032] Instead of using the cathode contacts 184 described above, theelectric potential can be applied to the workpiece 160 using a ringconductor. Further, other methods of applying the electric potential tothe workpiece may be used in accordance with the present invention. Forexample, a liquid conductor or an inflatable tube coated with aconductive material may be used in the present invention. An example ofusing the liquid conductor or the conductive tube to provide thenecessary electric potential is disclosed in the co-pending U.S.application Ser. No. 09/283,024, entitled “Method And Apparatus ForForming an Electric Contact With a Semiconductor Substrate”, commonlyowned by the assignee of the present invention, the contents of whichare expressly incorporated herein by reference. What is important tonote from the previous examples is that any method for providing anelectric potential between the anode or anodes and the cathode workpiececan be used in the present invention.

[0033]FIG. 4A illustrates a perspective view of a first pad-anodeassembly in accordance with the present invention. An anode assembly 122(120 a, 120 b, etc. in FIG. 3) includes a unique pad-anode arrangementfor plating the workpiece 160. Multiple strips of pad 132 (130 a, 130 b,etc. in FIG. 3) are attached, glued, or machined onto a cylindricalanode 142 (140 a, 140 b, etc. in FIG. 3) such that the pads 132 protrudefrom the outer surface of the anode 142. In this arrangement, the pads132 are formed on the anode 142 in a circular manner such that the pads132 wrap around the anode 142. The cylindrical anode 142 is furtherconnected to a shaft 192 for rotating about axis 150.

[0034]FIG. 4B illustrate a perspective view of a second pad-anodeassembly in accordance with the preferred embodiment of the presentinvention. Again, the anode assembly 124 (120 a, 120 b, etc. in FIG. 3)includes a unique pad-anode arrangement for plating the workpiece 160.Similar to FIG. 4A, multiple strips of pad 134 (130 a, 130 b, etc. inFIG. 3) are attached, glued, or machined onto a cylindrical anode 144(140 a, 140 b, etc. in FIG. 3) such that the pads 134 protrude from theouter surface of the anode 144. However, in this arrangement, the pads134 are formed on the anode 144 in a manner such that the pads 134 runalong the longitudinal side of the cylindrical anode 144 in asubstantially straight manner. This is illustrated in FIG. 4B. Thecylindrical anode 144 is further connected to a shaft 194 for rotatingabout axis 150.

[0035] It should be appreciated that many other designs of pad stripscan also be used effectively in the present invention. What is importantis that these strips cause rigorous stirring of the electrolyte at theworkpiece surface. The pad strips described thus far in FIGS. 3, 4A, and4B are relatively wide (2 to 20 mm). In other embodiments, narrow strips(1 to 2 mm) that are shaped like blades can be used in the presentinvention. These blades are of a type similar to windshield wiper bladesused in automobiles and are made preferably from polymeric materialsthat are compatible with the plating solution used in the invention. Thepad strips may be made of a porous or non-porous polymeric material withor without abrasive particles contained therein. Both the pad strips andblades can be rigid or flexible. What is important is that the padstrips/blades material is stable and can be employed in conjunction withvarious plating solutions that can be used in this invention.

[0036] In another embodiment of the present invention, the pad strips orblades 130 a, 130 b, etc., in FIG. 3 may be made of a conductivematerial. In this case, it should be assured that the pad strips orblades 130 a, 130 b, etc., do not touch the workpiece 160 surface duringthe plating operation, as described in more detail later herein.

[0037] FIGS. 5-6 illustrate cross sectional views of embodiments usinganode rods in accordance with the preferred embodiment of the presentinvention. In these embodiments, rather than having one largecylindrical anode for each anode assembly as shown in FIG. 3, multipleanode rods are enclosed in cylindrical anode assemblies. For example,FIG. 5 illustrates an anode assembly 300 having multiple anode rods 310a, 310 b, etc., extending from one end of the assembly 300 to the otherend within the cylindrical space contained by the wall 300 a.Preferably, the anode rods are between 1 mm to 3 mm in diameter.Although the anode rods 310 a, 310 b, etc., are schematically shown asnot in contact with each other, the anode rods 310 a, 310 b, etc., maybe in contact with each other in other embodiments. Furthermore, anodepellets of various shapes and sizes may be substituted for anode rods inthe cylindrical cavity within the walls 300 a or a combination of anoderods and pellets may be used.

[0038] The anode assemblies of FIGS. 5 and 6 should preferably includepores/holes 300 b, as shown herein. The plating solution can enter thecylindrical cavity through the pores/holes 300 b, thereby forming anelectrical and physical contact between the plating solution and theanode rods/pellets.

[0039] The anode assembly 300 also includes pads 320 (130 a, 130 b, etc.in FIG. 3) as described earlier. A shaft 330 extends through the centerof the anode assembly 300 such that the anode assembly 300 may berotated in a circular motion (either clockwise or counterclockwise). Thematerial 340 surrounding the rods/pellets 310 a, 310 b, etc, and theshaft 330 is preferably made from an insulating polymeric material. Theanode rods/pellets 310 a, 310 b, etc., are preferably made from the samematerial that is deposited on the workpiece. For example, for Cudeposition, rods/pellets 310 a, 310 b, etc., should be preferably madefrom Cu. The rods/pellets 310 a, 310 b, etc., may be replacedoccasionally as they are in constant use.

[0040]FIG. 6 illustrates an anode assembly 350 similar to that of FIG. 5except blades 360 are used instead of pads 320.

[0041]FIG. 7 illustrates a cross sectional view of another embodiment ofthe present invention where a separate anode plate is used instead ofthe cylindrical anodes. A chamber 400 includes one or more cylindricalrollers 410 a, 410 b, etc., having pad type objects 420 a, 420 b, etc.,attached/mounted thereon. The rollers 410 a, 410 b, etc., are preferablymade from polymeric materials or metals such as Ti that are chemicallyand mechanically stable in an electrolyte solution 440. The pad typeobjects 420 a, 420 b, etc., are attached, mounted, etc. on the rollers410 a, 410 b, etc., in a manner similar to that described with referenceto FIG. 3.

[0042] The chamber 400 includes an anode plate 460 on the bottom of thechamber 400. Any known method for attaching the anode plate 460 to thebottom of the chamber 400 may be used. In the alternative, the anodeplate 460 may be positioned at any other location in the chamber 400 solong as it makes physical contact with the electrolyte solution 440. Theelectrolyte solution 440 in the chamber 400 also makes contact with thepads 420 a, 420 b, etc. The electrolyte solution 440 can be originallyfed into the chamber 400 via a reservoir (not shown) through anin-channel (not shown).

[0043] Upon application of power between the workpiece 160 via, forexample, contacts 184 and the anode plate 460, and upon rotating one ormore rollers 410 a, 410 b, etc. about axis 450 in either a clockwise orcounterclockwise direction, the electrolyte solution 440 is continuouslysplashed/applied to the workpiece 160 via pads 420 a, 420 b, etc. Shafts470 a, 470 b, etc., are used to rotate the rollers 410 a, 410 b, etc,respectively. Thus, metal is plated out of the electrolyte solution 440onto the workpiece 160 surface. As disclosed earlier herein, rollerswith blade type objects instead of pads can be used.

[0044] In another embodiment of the present invention, the pad/blade 420a, 420 b, etc. material in FIG. 7 may be constructed/made from a highlyconductive fabric or polymeric material such as polyanilines. In thiscase, the electric contact 184 to the workpiece 160 is not needed.Instead, an electric contact to the conductive pads/blades 420 a, 420 b,etc., is provided (not shown). Upon application of power between theanode plate 460 and conductive pads/blades 420 a, 420 b, etc., and uponrotating the rollers 410 a, 410 b, etc., in a manner such that thepads/blades 420 a, 420 b, etc., make contact with the workpiece 160surface, the electrolyte solution 440 is continuously applied to theworkpiece 160, and metal from the electrolyte solution 440 is platedonto the workpiece 160 surface. It should be noted that in this case,cathodic voltage is applied to the workpiece 160 surface using theconductive pads/blades 420 a, 420 b, etc., as they make contact with theworkpiece 160. Metal from the electrolyte solution 440 is plated on theworkpiece 160 surface rather than on the conductive pads/blades 420 a,420 b, etc., because plating efficiency is much higher on the workpiece160 surface than on the conductive pads/blades 420 a, 420 b, etc.

[0045]FIG. 8 illustrates yet an additional embodiment of the presentinvention. While operating the anode assemblies in FIG. 8, theelectrolyte solution can be introduced to the pads or blades from aninlet channel (not shown) located inside or in proximity to the anodes.A chamber 600 includes anode assemblies 610 a, 610 b, etc., having padtype objects 620 a, 620 b, etc., attached/mounted on the cylindricalanodes 630 a, 630 b, etc. Shafts 640 a, 640 b, etc., are used to rotatethe anode assemblies 610 a, 610 b, etc., about axis 650. In thisembodiment, unlike the previous embodiments, an electrolyte solution isnot disposed in the chamber 600. The electrolyte solution is flowedthrough the anode assemblies 610 a, 610 b, etc., via passageways andholes within the outer periphery of the anodes 630 a, 630 b, etc., whichprovide paths for the solution to be fed to the gaps between the anodes630 a, 630 b, etc., and the cathode workpiece 160. Alternatively, theelectrolyte solution can be dispensed directly onto the anode assemblies610 a, 610 b, etc., through another channel (not shown). The electrolytesolution that drops to the bottom of the chamber 600 is flowed out ofthe chamber 600 via one or more outlet passageways 690. Other means ofremoving the electrolyte solution from the chamber 600 may be used inaccordance with the present invention.

[0046] The attractive feature of the design of FIG. 8 is that theapparatus can be operating in a vertical geometry (i.e., apparatus inFIG. 8 rotated by 90 degrees). In other embodiments, a configurationwhere the anode assemblies 610 a, 610 b, etc., are positioned over ofthe cathode workpiece, rather than underneath, can be implemented.

[0047] Referring back to the embodiment in FIGS. 7 and 8, the rollers410 a, 410 b, etc., having the pad strips 420 a, 420 b, etc., and theanode assemblies 610 a, 610 b, etc., should preferably rotate at a ratesuch that the electrolyte solution is continuously applied/splashed ontothe workpiece. The rollers 410 a, 410 b, etc., or the anode assemblies610 a, 610 b, etc., may all rotate in the same clockwise orcounterclockwise direction or alternatively, some may rotate in onedirection (i.e., clockwise) while others may rotate in the oppositedirection (i.e., counterclockwise). Further, during operation, one, two,three, . . . , or all rollers 410 a, 410 b, etc., or anode assemblies610 a, 610 b, etc., may be activated concurrently and/or voltages may beapplied to all or only a selected number of them (only anode assemblies610 a, 610 b, etc.). In addition, the length of the rollers 410 a, 410b, etc., and the anode assemblies 610 a, 610 b, etc., may all be thesame or they may be different.

[0048] In all embodiments described herein, the hardness of the pad orblade type objects is related to the relative speed of rotation of thepads or blades with respect to the workpiece.

[0049] Although both DC and pulsed power supplies can be used to applypower to the anode(s) and the workpiece, the present invention mayreduce the need for pulse generating power supplies because themechanical pulsing that is generated from the movement of the pads orblades relative to the face of the workpiece creates sufficient pulsing.This mechanical pulsing is created as a result of the workpiece being inproximity with the pads or blades as it is moved in relation to theworkpiece. The benefit of the mechanical pulsing is that it improvesgrain size, filling efficiency of the contact holes, vias, and trenches,and copper film integrity without the need for power supplies withpulsing capabilities.

[0050] In additional to the mechanical pulsing, the anode assembliesdisclosed herein can provide electrical pulsing. If the pad and/or bladematerials are insulating, then the plating current density decreases asthe cylindrical anode is rotating when the pad and/or blades are intheir closest distance to the workpiece surface. On the other hand, whenthe pad/blade is not in their closest distance to the workpiece surface(i.e., the gaps in between each pad/blade) as the cylindrical anode isrotated, then the current density increases. Such pulsing is found to bebeneficial for forming a high quality material on the workpiece surface.

[0051] Although deposition of a conductive material has so far beendescribed hereinabove, those skilled in the art can use the teachingsherein for etching and electroetching processes. For example, if thevoltage applied between the workpiece and the anode(s) is such that theworkpiece is more negative than the anode(s), then plating on theworkpiece surface occurs. If the voltage is zero, then chemical etchingof the conductive material on the workpiece surface occurs. If thepolarity voltage is reversed, then electroetching of the conductivematerial from the workpiece surface can be initiated. Alternately, theapparatus disclosed herein can be used for electroless deposition ofmaterials such as Cu, Ni, Ni—P, Co, etc. In this case, an electrolessdeposition solution is used rather than the electrodepositionelectrolyte solution.

[0052] Although the embodiments shown thus far illustrate one workpiece,it is understood that more than one workpiece head assembly could beused with the present invention. Furthermore, each chamber describedabove may include various numbers of anode/roller assemblies so long asthey can effectively plate a conductive layer on a workpiece surface.

[0053] In the previous descriptions, numerous specific details are setforth, such as specific materials, structures, chemicals, processes,etc., to provide a thorough understanding of the present invention.However, as one having ordinary skill in the art would recognize, thepresent invention can be practiced without resorting to the detailsspecifically set forth.

[0054] Although only the above embodiments have been described in detailabove, those skilled in the art will readily appreciate that manymodifications of the exemplary embodiment are possible withoutmaterially departing from the novel teachings and advantages of thisinvention.

I claim:
 1. An apparatus for depositing a conductive material on asurface of a workpiece, comprising: a workpiece head assembly adapted tosupport the workpiece; and a chamber having: a plurality of anodeassemblies, wherein each anode assembly is adapted to rotate in acircular direction and includes an anode and one or more pad or bladestrips attached to an outer surface of the anode; and an electrolytesolution including the conductive material, the electrolyte solutionadapted to be applied to the surface of the workpiece upon rotating theplurality of anode assemblies.
 2. The apparatus according to claim 1,wherein the anode comprises of a cylindrical anode.
 3. The apparatusaccording to claim 2, wherein the cylindrical anode comprises a hollowcylinder.
 4. The apparatus according to claim 3, wherein the cylindricalanode comprises one of carbon and titanium.
 5. The apparatus accordingto claim 4, wherein the cylindrical anode comprises a diameter between10 to 30 mm.
 6. The apparatus according to claim 1, wherein the one ormore pad or blade strips are wrapped around the outer surface of thecylindrical anode.
 7. The apparatus according to claim 1, wherein theone or more pad or blade strips are attached to the outer surface of theanode along a longitudinal side of the cylindrical anode.
 8. Theapparatus according to claim 1, wherein the workpiece head assembly isfurther adapted to move up and down and side to side.
 9. The apparatusaccording to claim 1, wherein the workpiece head assembly is furtheradapted to rotate in a clockwise or counterclockwise direction.
 10. Theapparatus according to claim 1, wherein the one or more pad stripsinclude width that are 2-20 mm.
 11. The apparatus according to claim 1,wherein the one or more blade strips include width that are 1-2 mm. 12.The apparatus according to claim 1, wherein the one or more pad stripscomprise one of porous, non-porous, conductive, and non-conductivematerial.
 13. The apparatus according to claim 12, wherein the one ormore pad strips further include abrasive particles.
 14. The apparatusaccording to claim 1, wherein the anode comprises one of a plurality ofanode rods and a plurality of anode pellets.
 15. The apparatus accordingto claim 14, wherein the plurality of anode assemblies further includesa plurality of holes.
 16. The apparatus according to claim 1, whereinthe workpiece comprises one of a wafer, a flat panel, and a magneticfilm head.
 17. A method of depositing a conductive material on a surfaceof a workpiece, comprising the steps of: applying a voltage between aplurality of anodes having pad or blade strips and the workpiece;rotating the plurality of anodes in a circular direction; andcontinuously applying an electrolyte solution having the conductivematerial to the surface of the workpiece as the plurality of anodes arerotated in the circular direction.
 18. The method according to claim 17,wherein the plurality of anodes comprise of cylindrical anodes.
 19. Themethod according to claim 18, wherein the cylindrical anodes compriseshollow cylinders.
 20. The method according to claim 19, wherein thecylindrical anodes comprise one of carbon and titanium.
 21. The methodaccording to claim 19, wherein the cylindrical anodes comprise diametersbetween 10 to 30 mm.
 22. The method according to claim 17, wherein afirst predetermined number of the plurality of anodes are rotated in aclockwise direction and a second predetermined number of the pluralityof anodes are rotated in a counterclockwise direction.
 23. The methodaccording to claim 17, wherein the electrolyte solution is flowedthrough passageways and holes in the plurality of anodes to the surfaceof the workpiece.
 24. The method according to claim 17, wherein the pador blade strips are attached to outer surfaces of the plurality ofanodes.
 25. An apparatus for depositing a conductive material on asurface of a workpiece, comprising: a workpiece head assembly adapted tosupport the workpiece; and a chamber having: a plurality of rollers,wherein each roller is adapted to rotate in a circular direction andincludes one or more pad or blade strips attached to an outer surface ofthe roller; an electrolyte solution including the conductive material,the electrolyte solution adapted to be applied to the surface of theworkpiece upon rotating the plurality of rollers; and an anode platepositioned in the chamber such that the electrolyte solution makescontact with the anode plate.
 26. The apparatus according to claim 25,wherein the anode plate is positioned on a bottom wall of the chamber.27. The apparatus according to claim 25, wherein the anode plate ispositioned on a side wall of the chamber.
 28. The apparatus according toclaim 25, wherein the one or more pad or blade strips are wrapped aroundthe outer surface of the roller.
 29. The apparatus according to claim25, wherein the one or more pad or blade strips are attached to theouter surface of the roller along a longitudinal side of the roller. 30.The apparatus according to claim 25, wherein the workpiece head assemblyis further adapted to move up and down and side to side.
 31. Theapparatus according to claim 25, wherein the workpiece head assembly isfurther adapted to rotate in a clockwise or counterclockwise direction.32. The apparatus according to claim 25, wherein the one or more padstrips include width that are 2-20 mm.
 33. The apparatus according toclaim 25, wherein the one or more blade strips include width that are1-2 mm.
 34. The apparatus according to claim 25, wherein the one or morepad strips comprise one of porous, non-porous, conductive, andnon-conductive material.
 35. The apparatus according to claim 25,wherein the one or more pad strips further include abrasive particles.36. A method of depositing a conductive material on a surface of aworkpiece, comprising the steps of: applying a voltage between an anodeplate and the workpiece; rotating a plurality of rollers having pad orblade strips in a circular direction; and continuously applying anelectrolyte solution having the conductive material to the surface ofthe workpiece as the plurality of rollers are rotated in the circulardirection.
 37. The method according to claim 36, wherein the pluralityof rollers comprise of cylindrical rollers.
 38. The method according toclaim 37, wherein the cylindrical rollers comprise hollow cylinders. 39.The method according to claim 38, wherein the cylindrical rollerscomprise diameters between 10 to 30 mm.
 40. The method according toclaim 36, wherein a first predetermined number of the plurality ofrollers are rotated in a clockwise direction and a second predeterminednumber of the plurality of rollers are rotated in a counterclockwisedirection.
 41. The method according to claim 36, wherein the pad orblade strips are attached to outer surfaces of the plurality of rollers.42. A method of depositing a conductive material on a surface of aworkpiece, comprising the steps of: applying a voltage between an anodeplate and a plurality of rollers having conductive pads or blade strips,wherein the pads or blades strips make contact with the workpiece;rotating a plurality of rollers having pad or blade strips in a circulardirection; and continuously applying an electrolyte solution having theconductive material to the surface of the workpiece as the plurality ofrollers are rotated in the circular direction.
 43. The method accordingto claim 42, wherein the plurality of rollers comprise of cylindricalrollers.
 44. The method according to claim 42, wherein the cylindricalrollers comprise hollow cylinders.
 45. The method according to claim 44,wherein the cylindrical rollers comprise diameters between 10 to 30 mm.46. The method according to claim 42, wherein a first predeterminednumber of the plurality of rollers are rotated in a clockwise directionand a second predetermined number of the plurality of rollers arerotated in a counterclockwise direction.
 47. The method according toclaim 42, wherein the pad or blade strips are attached to outer surfacesof the plurality of rollers.
 48. An apparatus for depositing aconductive material on a surface of a workpiece, comprising: a workpiecehead assembly adapted to support the workpiece; and a chamber having: aplurality of anode assemblies, wherein each anode assembly is adapted torotate in a circular manner and includes an anode, one or more pad orblade strips attached to an outer surface of the anode, and means forintroducing an electrolyte solution having the conductive material tothe one or more pad or blade strips such that the conductive material isapplied to the surface of the workpiece upon rotating the plurality ofanode assemblies.
 49. The apparatus according to claim 48, wherein theanode comprises of a cylindrical anode.
 50. The apparatus according toclaim 49, wherein the one or more pad or blade strips are wrapped aroundthe outer surface of the cylindrical anode.
 51. The apparatus accordingto claim 49, wherein the one or more pad or blade strips are attached tothe outer surface of the anode along a longitudinal side of thecylindrical anode.
 52. The apparatus according to claim 48, wherein theworkpiece head assembly is further adapted to move up and down and sideto side.
 53. The apparatus according to claim 48, wherein the workpiecehead assembly is further adapted to rotate in a clockwise orcounterclockwise direction.
 54. The apparatus according to claim 48,wherein the one or more pad strips include width that are 2-20 mm. 55.The apparatus according to claim 48, wherein the one or more bladestrips include width that are 1-2 mm.
 56. The apparatus according toclaim 48, wherein the one or more pad strips comprise one of porous,non-porous, conductive and none-conductive material.
 57. The apparatusaccording to claim 56, wherein the one or more pad strips furtherinclude abrasive particles.
 58. The apparatus according to claim 48,wherein the means for introducing the electrolyte solution comprisespassageways and holes in the plurality of anode assemblies.
 59. Theapparatus according to claim 48, wherein the workpiece comprises one ofa wafer, a flat panel, and a magnetic film head.
 60. The apparatusaccording to claim 48, wherein the electrolyte solution comprises anelectroless deposition solution.
 61. The apparatus according to claim60, wherein the electroless deposition solution comprises one of Cu, Ni,NI—P, and Co.
 62. A method of etching a conductive material on a surfaceof a workpiece, comprising the steps of: applying a zero voltage betweenone or more anodes having pad or blade strips and the workpiece;rotating the one or more anodes in a circular direction; and applying anetching solution to the surface of the workpiece as the one or moreanodes are rotated in the circular direction.
 63. A method ofelectroetching a conductive material on a surface of a workpiece,comprising the steps of: applying a voltage between one or more anodeshaving pad or blade strips and the workpiece, wherein the voltage at theworkpiece is more positive than the voltage at the one or more anodes;rotating the one or more anodes in a circular direction; and applying anetching solution to the surface of the workpiece as the one or moreanodes are rotated in the circular direction.
 64. A method ofelectroetching a conductive material on a surface of a workpiece,comprising the steps of: applying a voltage between an anode plate andworkpiece, wherein the voltage at the workpiece is more positive thanthe voltage at the anode plate; rotating one or more rollers having pador blade strips in a circular direction; and applying an etchingsolution to the surface of the workpiece as the one or more rollers arerotated in the circular direction.